Ram memory 8GB kit (2 x 4GB) DDR3 PC3-12800,1600MHz, 204 PIN SODIMM for laptops

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Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866". May 2013 . Retrieved 2019-09-08. DDR3L VDD/VDDQ requirements - Power Supply: DDR3L operation = 1.283 V to 1.45 V; DDR3 operation = 1.425 V to 1.575 V .. Once initialized for DDR3L operation, DDR3 operation may only be used if the device is in reset while VDD and VDDQ are changed for DDR3 operation Dell Energy Smart Solution Advisor". Essa.us.dell.com. Archived from the original on 2013-08-01 . Retrieved 2013-07-28.

How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream". techpowerup.com . Retrieved 19 March 2018. JEDEC Solid State Technology Association announced the publication of JEDEC DDR3L on July 26, 2010 [35] and the DDR3U in October 2011. [36] Feature summary [ edit ] Components [ edit ]According to JEDEC, [11] :111 1.575 volts should be considered the absolute maximum when memory stability is the foremost consideration, such as in servers or other mission-critical devices. In addition, JEDEC states that memory modules must withstand up to 1.80 volts [a] before incurring permanent damage, although they are not required to function correctly at that level. [11] :109

DDR3: Frequently Asked Questions" (PDF). Archived from the original (PDF) on 2009-12-29 . Retrieved 2009-08-18. As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9ns) was available in time to coincide with the Intel Core i7 release in late 2008, [19] while later developments made DDR3-2400 widely available (with CL 9–12cycles = 7.5–10ns), and speeds up to DDR3-3200 available (with CL 13cycles = 8.125ns). The DDR3L ( DDR3 Low Voltage) standard is an addendum to the JESD79-3 DDR3 Memory Device Standard specifying low voltage devices. [31] The DDR3L standard is 1.35V and has the label PC3L for its modules. Examples include DDR3L‐800 (PC3L-6400), DDR3L‐1066 (PC3L-8500), DDR3L‐1333 (PC3L-10600), and DDR3L‐1600 (PC3L-12800). Memory specified to DDR3L and DDR3U specifications is compatible with the original DDR3 standard, and can run at either the lower voltage or at 1.50 V. [32] However, devices that require DDR3L explicitly, which operate at 1.35V, such as systems using mobile versions of fourth-generation Intel Core processors, are not compatible with 1.50V DDR3 memory. [33] DDR3L is different from and incompatible with the LPDDR3 mobile memory standard.

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SPD (Serial Presence Detect), from JEDEC standard No. 21-C (JESD21C: JEDEC configurations for solid state memories) DDR3 dual-inline memory modules (DIMMs) have 240 pins and are electrically incompatible with DDR2. A key notch—located differently in DDR2 and DDR3 DIMMs—prevents accidentally interchanging them. Not only are they keyed differently, but DDR2 has rounded notches on the side and the DDR3 modules have square notches on the side. [16] DDR3 SO-DIMMs have 204 pins. [17] Fully buffered modules, which are designated by F or FB and do not have the same notch position as other classes. Fully buffered modules cannot be used with motherboards that are made for registered modules, and the different notch position physically prevents their insertion. a b Sobolev, Vyacheslav (2005-05-31). "JEDEC: Memory standards on the way". DigiTimes.com. Archived from the original on April 13, 2013 . Retrieved 2011-04-28. JEDEC is already well along in the development of the DDR3 standard, and we have been working on it for about three years now.... Following historical models, you could reasonably expect the same three-year transition to a new technology that you have seen for the last several generations of standard memory

Our energy supplier is working towards using 100% renewable electricity and is a Principal Partner of COP26 JEDEC Solid State Technology Association announced the publication of Release 4 of the DDR3 Serial Presence Detect (SPD) document on September 1, 2011. [27] XMP extension [ edit ] Understanding DDR3 Serial Presence Detect (SPD) Table". simmtester.com . Retrieved 12 December 2015. Release 4 of the DDR3 Serial Presence Detect (SPD) document (SPD4_01_02_11) adds support for Load Reduction DIMMs and also for 16b-SO-DIMMs and 32b-SO-DIMMs. Fractional frequencies are normally rounded down, but rounding up to 667 is common because of the exact number being 666 2⁄ 3 and rounding to the nearest whole number. Some manufacturers also round to a certain precision or round up instead. For example, PC3-10666 memory could be listed as PC3-10600 or PC3-10700. [23]ECC memory, which has an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC or E in their designation. For example: "PC3-6400 ECC", or PC3-8500E. [29] While the typical latencies for a JEDEC DDR2-800 device were 5-5-5-15 (12.5ns), some standard latencies for JEDEC DDR3 devices include 7-7-7-20 for DDR3-1066 (13.125ns) and 8-8-8-24 for DDR3-1333 (12ns). Chang, Jaci (2004). "Design Considerations for the DDR3 Memory Sub-System" (PDF). Jedex. p.4. Archived from the original (PDF) on 2012-07-24 . Retrieved 2020-08-12. Power consumption of individual SDRAM chips (or, by extension, DIMMs) varies based on many factors, including speed, type of usage, voltage, etc. Dell's Power Advisor calculates that 4GB ECC DDR1333 RDIMMs use about 4W each. [20] By contrast, a more modern mainstream desktop-oriented part 8GB, DDR3/1600 DIMM, is rated at 2.58W, despite being significantly faster. [21] Modules [ edit ] List of standard DDR3 SDRAM modules